Roger Dangel, Antonio La Porta, et al.
Networks 2016
On the basis of a realized 12 × 10 Gb/s card-to-card optical link demonstrator, the capabilities of a polymer-waveguide-based board-level optical interconnect technology are presented. The conception and realization of the modular building blocks required for this board-level optical interconnect technology are described in detail. In particular, we report on the fabrication and characterization of board-integrated optical low-loss polymer waveguides that are compatible with printed circuit board (PCB) manufacturing processes. We also explain our fully passive alignment technique, superseding time-consuming active positioning of components and connectors. To realize optical transceiver modules comprising vertical cavity surface emitting laser (VCSEL) arrays with laser drivers and photodetector arrays with transimpedance amplifiers (TIAs), a mass-production concept based on wafer-level processing has been elaborated and successfully implemented. © 2008 IEEE.
Roger Dangel, Antonio La Porta, et al.
Networks 2016
Stefan Abel, Folkert Horst, et al.
OECC/PSC 2019
Roger Dangel, Jens Hofrichter, et al.
Optics Express
Christoph Berger, Laurent Dellmann, et al.
SPIE IOPTO 2008