Mitsuru Ueda, Hideharu Mori, et al.
Journal of Polymer Science Part A: Polymer Chemistry
The increasing levels of device integration and the drive towards system-on-a-chip approaches have created an insatiable demand for fine pitch and high performance silicon back end of the line (BEOL) interconnects. This paper discusses the challenges associated with producing, characterizing and integrating porous dielectrics into the BEOL interconnects and presents results from integration evaluations.
Mitsuru Ueda, Hideharu Mori, et al.
Journal of Polymer Science Part A: Polymer Chemistry
Julian J. Hsieh
Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Min Yang, Jeremy Schaub, et al.
Technical Digest-International Electron Devices Meeting
Biancun Xie, Madhavan Swaminathan, et al.
EMC 2011