Paper
The DX centre
T.N. Morgan
Semiconductor Science and Technology
The increasing levels of device integration and the drive towards system-on-a-chip approaches have created an insatiable demand for fine pitch and high performance silicon back end of the line (BEOL) interconnects. This paper discusses the challenges associated with producing, characterizing and integrating porous dielectrics into the BEOL interconnects and presents results from integration evaluations.
T.N. Morgan
Semiconductor Science and Technology
William G. Van der Sluys, Alfred P. Sattelberger, et al.
Polyhedron
Ranulfo Allen, John Baglin, et al.
J. Photopolym. Sci. Tech.
A. Krol, C.J. Sher, et al.
Surface Science