Effects of environment on modulus of low-k porous films used in back end of line
- Eva E. Simonyi
- Christos D. Dimitrakopoulos
- et al.
- 2007
- MRS Spring Meeting 2007
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48 results for E. Simonyi
A 45 nm CMOS node Cu/low-k/ ULtra low-k PECVD SiCOH (k=2.4) BEOL technology
- S. Sankaran
- S. Arai
- et al.
- 2006
- IEDM 2006
Application of nanoindentation to characterize fracture in ILD films used in the BEOL
- Eva E. Simonyi
- E. Liniger
- et al.
- 2005
- MRS Spring Meeting 2005
Characterization of spin -on glasses by microindentation
- E. Simonyi
- K.-W. Lee
- et al.
- 1998
- MRS Spring Meeting 1998
Properties development during curing of low dielectric-constant spin-on glasses
- R.F. Cook
- E. Liniger
- et al.
- 1998
- MRS Spring Meeting 1998
A buckling-based metrology for measuring the elastic moduli of polymeric thin films
- Christopher M. Stafford
- Christopher Harrison
- et al.
- 2004
- Nature Materials
Integration compatible porous SiCOH dielectrics from 45 to 22 nm
- S. Gates
- A. Grill
- et al.
- 2008
- ADMETA 2008
Low-k spacers for advanced low power CMOS devices with reduced parasitic capacitances
- Elbert Huang
- Eric Joseph
- et al.
- 2008
- IEEE International SOI Conference 2008
Chemical and mechanical properties of UV-cured nanoimprint resists and release layer interactions
- Frances A. Houle
- Ann Fornof
- et al.
- 2008
- SPIE Advanced Lithography 2008
Development and optimization of porous pSiCOH interconnect dielectrics for 45 nm and beyond
- A. Grill
- S. Gates
- et al.
- 2008
- IITC 2008