About cookies on this site Our websites require some cookies to function properly (required). In addition, other cookies may be used with your consent to analyze site usage, improve the user experience and for advertising. For more information, please review your options. By visiting our website, you agree to our processing of information as described in IBM’sprivacy statement. To provide a smooth navigation, your cookie preferences will be shared across the IBM web domains listed here.
Publication
IPDPSW 2020
Conference paper
Node-aware stencil communication for heterogeneous supercomputers
Abstract
High-performance distributed computing systems increasingly feature nodes that have multiple CPU sockets and multiple GPUs. The communication bandwidth between these components is non-uniform. Furthermore, these systems can expose different communication capabilities between these components. For communication-heavy applications, optimally using these capabilities is challenging and essential for performance. Bespoke codes with optimized communication may be non-portable across run-time/software/hardware configurations, and existing stencil frameworks neglect optimized communication. This work presents node-aware approaches for automatic data placement and communication implementation for 3D stencil codes on multi-GPU nodes with non-homogeneous communication performance and capabilities. Benchmarking results in the Summit system show that choices in placement can result in a 20% improvement in single-node exchange, and communication specialization can yield a further 6x improvement in exchange time in a single node, and a 16% improvement at 1536 GPUs.