Conference paperCoupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systemsBiancun Xie, Madhavan Swaminathan, et al.EMC 2011
PaperApplication of block-copolymer supramolecular assembly for the fabrication of complex TiO2 nanostructuresSung Ho Kim, Oun-Ho Park, et al.Small
PaperLight-coupling masks: An alternative, lensless approach to high-resolution optical contact lithographyHeinz Schmid, Hans Biebuyck, et al.Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
PaperSurface crystallography of the c(2×2) sodium overlayer on Al(100)B.A. Hutchins, T.N. Rhodin, et al.Surface Science
