About cookies on this site Our websites require some cookies to function properly (required). In addition, other cookies may be used with your consent to analyze site usage, improve the user experience and for advertising. For more information, please review your options. By visiting our website, you agree to our processing of information as described in IBM’sprivacy statement. To provide a smooth navigation, your cookie preferences will be shared across the IBM web domains listed here.
Publication
Journal of Computer-Aided Materials Design
Paper
Large-scale simulations of crack-void and void-void plasticity in metallic fcc crystals under high strain rates
Abstract
We have simulated the failure of three-dimensional fcc solids containing voids under mode one tension using molecular dynamics, simple interatomic potentials and a system comprising 15 million atoms. When a linear brittle crack front approaches a void, the void acts to impede the progress of the front by causing dislocation emission, thereby rendering the system ductile. When two voids are alone in the system, failure is via ductility with, first, dislocation loops being emitted from the void surfaces and, then, these loops interacting with one another to form.