Journal of Computer-Aided Materials Design

Large-scale simulations of crack-void and void-void plasticity in metallic fcc crystals under high strain rates

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We have simulated the failure of three-dimensional fcc solids containing voids under mode one tension using molecular dynamics, simple interatomic potentials and a system comprising 15 million atoms. When a linear brittle crack front approaches a void, the void acts to impede the progress of the front by causing dislocation emission, thereby rendering the system ductile. When two voids are alone in the system, failure is via ductility with, first, dislocation loops being emitted from the void surfaces and, then, these loops interacting with one another to form.