Solder-Reflowable, High-Throughput Fiber Assembly Achieved by Partitioning of Adhesive Functions
- Alexander Janta-Polczynski
- Elaine Cyr
- et al.
- 2018
- ECTC 2018
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9 results at ECTC 2018
2D magnetic inductors for DC-DC converters on glass interposer
- Vincent Lafage
- Yann Beilliard
- et al.
- 2018
- ECTC 2018
Injection of Molten Solder (IMS) Technology for Solder Bumping on Wafers, Ceramic/Organic/Flexible Substrates, and Si Via Filling from Fine Pitch to Large Pitch
- Jae Woong Nah
- Li-Wen Hung
- et al.
- 2018
- ECTC 2018
Heterogeneous integration technology demonstrations for future healthcare, IoT, and AI computing solutions
- John Knickerbocker
- Russell A. Budd
- et al.
- 2018
- ECTC 2018
Backward compatible connectors for next generation PCIe electrical I/O
- Lei Shan
- Daniel Freidman
- et al.
- 2018
- ECTC 2018
Column Interconnects: A Path Forward for Embedded Cooling of High Power 3D Chip Stacks
- Mark D. Schultz
- Cyril Cabral
- et al.
- 2018
- ECTC 2018
High-speed precision handling technology of micro-chip for fan-out wafer level packaging (FOWLP) application
- Qianwen Chen
- Li-Wen Hung
- et al.
- 2018
- ECTC 2018
An Enhanced 64-Element Dual-Polarization Antenna Array Package for W-Band Communication and Imaging Applications
- Xiaoxiong Gu
- Duixian Liu
- et al.
- 2018
- ECTC 2018
Laser Sintering of Dip-Based All-Copper Interconnects
- Luca Del Carro
- Martin Kossatz
- et al.
- 2018
- ECTC 2018