R.M. Macfarlane, R.L. Cone
Physical Review B - CMMP
This paper presents an overview of issues associated with Al dual damascene process technology. Different integration schemes are discussed and characteristics of metal fill, planarization and reliability are highlighted. Finally, a comparison is made between Al dual damascene, Al RIE, and Cu dual damascene.
R.M. Macfarlane, R.L. Cone
Physical Review B - CMMP
Kafai Lai, Alan E. Rosenbluth, et al.
SPIE Advanced Lithography 2007
J. Tersoff
Applied Surface Science
J.K. Gimzewski, T.A. Jung, et al.
Surface Science