Publication
EOS/ESD 2015
Conference paper

3D integration ESD protection design and analysis

Abstract

A Design of Experiments (DOEs) matrix was created to evaluate probability of fails during a complex 3D integration process as a function of ESD protection level. A detailed set of pass/fail criteria based on circuit performance was established. Based on measured samples, functionality test and leakage test show circuit performance degradation and larger fail rate after chip bonding on designs without ESD protection.

Date

30 Oct 2015

Publication

EOS/ESD 2015

Authors

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