Liquid Metal Enabled Modular Architecture of Superconducting Quantum Processor
- Zhancheng Yao
- Martin Sandberg
- et al.
- 2024
- APS March Meeting 2024
I've worked on a wide variety of topics since joining IBM, including near-field microscopy, thermal imaging for disk drive application, MRAM and now quantum computing. My most recent work focuses on practical aspects of the technologies related to quantum computing, including the development of superconducting bump bonds, TSVs, multi-level wiring and applications into complete builds such as the recent 127 qubit Eagle device.