Jeffrey Burns

Katia Moskvitch

John Rozen

Kailash Gopalakrishnan

Mike Murphy

Markus F. Ritter

Andreas Fuhrer

Fabrizio Nichele

Donna Dillenberger

Dale McHerron

News

Research

Explainer

IBM researcher Heike Riel awarded the 2022 IEEE Andrew S. Grove Award and elected to the National Academy of Engineering

Redefining AI accelerators: A new chip packaging tech & a first in analog compute

IBM’s newest chip is more than meets the AI

You have Thanksgiving turkey to thank for LASIK

Vibrations could flip the switch on future superconducting devices

The IBM Research innovations powering IBM z16

The breakthrough that could simplify the 3D chipmaking supply chain

Semiconductors

IEDM 2022

SISC 2022

ECTC 2023

Chiplets

Hardware Technology

Science

Quantum

AI Hardware

Healthcare

Impact Science

The world is generating reams of data each day, and the AI systems built to make sense of it all constantly need faster and more robust hardware. We’re developing new devices and architectures to support the tremendous processing power AI requires to realize its full potential.

AI has the potential to solve some of the biggest challenges facing myriad industries. At IBM Research, we’re working on semiconductor innovations for the hybrid cloud and AI — foundational hardware technology that we can use to build the next generation of chips to solve those challenges. 

Foundational Hardware Technology

We’re driving infrastructure innovations spanning physical infrastructure, operating systems, and software-defined compute, network, and storage. Our goal is to create technologies that improve performance, reliability, security, and ease of operation across hybrid and multi-cloud environments.

Hybrid Cloud Infrastructure

The hybrid cloud is creating new opportunities to transform the way scientific research is done. From access to high-performance infrastructure, to support for multi-cloud deployments and cloud-native technologies like containers and serverless computing, we're driving full-stack innovations to transform R&D.

Hybrid Cloud HPC

M2.png

NatureElectronics_1260x709@2x.jpg

Operating an IBM z16 system designed and manufactured in Poughkeepsie, N.Y. 

ibmz16-leadspace-2520x1418.jpg

IBM and TEL Hit a Chip-making Milestone (300mm debonding)_01 (1).jpg

22-09-20-RLAVINE_ZURICH_RESEARCH_HR_00949 2.jpg

A new chip packaging tech & a first in analog compute

Blog_DigitalAIWafer_2520x1418px.jpg

A collection of IBM Telum 7nm processors on a silicon wafer.

IBM-Telum-Processor-Wafer-leadspace-2500x1418.jpg