Collective-effect state variables for post-CMOS logic applications
- A. Chen
- A.P. Jacob
- et al.
- 2009
- VLSI Technology 2009
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Reliability of a 300-mm-compatible 3DI technology based on hybrid Cu-adhesive wafer bonding
- R.R. Yu
- F. Liu
- et al.
- 2009
- VLSI Technology 2009