L.D. Bozano, B.W. Kean, et al.
Applied Physics Letters
Unique hybrid approach employing both model-based layout optimization and process improvement was successfully developed for reducing Rapid Thermal Anneal (RTA) driven intra-die variations. It has been applied to multiple bulk and 501 designs. The model developed herein enables fast estimation of broad-band reflectance of a random layout in 65nm, 45nm, and 32nm nodes and guides reflectance leveling in the post-design phase. This approach significantly reduces RTA-driven variations showing 30% reduction in intra die ring oscillator range in high- performance products.
L.D. Bozano, B.W. Kean, et al.
Applied Physics Letters
S. Sills, K. Unal, et al.
Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
P.D. Krasicky, R.H. Silsbee, et al.
Physical Review B
J.C. Scott, J.H. Kaufman, et al.
Journal of Applied Physics