Electrical characteristics of lossy interconnections for high-performance computer applications
- A. Deutsch
- G.V. Kopcsay
- et al.
- 1990
- SPIE Advances in Intelligent Robotics Systems 1990
Publications
14328 results for Physical Sciences
The application of electrodeposition processes to advanced package fabrication
- S. Krongelb
- J. Dukovic
- et al.
- 1990
- SPIE Advances in Intelligent Robotics Systems 1990
3-D capacitance modeling of advanced multilayer interconnection technologies
- Daniel C. Edelstein
- 1990
- SPIE Advances in Intelligent Robotics Systems 1990
CAD in new areas of the package and interconnect design space
- Dennis J. McBride
- 1990
- SPIE Advances in Intelligent Robotics Systems 1990
Metastable phase formation in thin film reactions
- K.N. Tu
- 1991
- Materials Science and Engineering: A
Fine structure of the Ca 2p x-ray-absorption edge for bulk compounds, surfaces, and interfaces
- F.J. Himpsel
- U.O. Karlsson
- et al.
- 1991
- Physical Review B
Systematics in the electronic structure of amorphous transition metal/tin alloys
- H.-G. Boyen
- G. Indlekofer
- et al.
- 1991
- Materials Science and Engineering: A
Low-energy electron diffraction and photoemission study of epitaxial films of Cu on Ag{001}
- H. Li
- D. Tian
- et al.
- 1991
- Physical Review B
Solid state amorphization of RE-TM (RE = Ce, Er and TM = Fe, Co) multilayers
- M. Matsuura
- R. Petkie
- et al.
- 1991
- Materials Science and Engineering: A
Multilayer relaxation of clean Ag{001}
- H. Li
- J. Quinn
- et al.
- 1991
- Physical Review B