Solder Joint Reliability of Fully Homogenised SAC-SnBi Low Temperature BGA Interconnections using Solid Liquid Inter-Diffusion (SLID)
- Hafiz Wakas Ali
- David Danovitch
- et al.
- 2023
- ECTC 2023
Publications
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- Semiconductors
679 results for Semiconductors
HBM3 Modules on Latest High Density Organic Laminate—Signal Integrity Design and Analysis with Interconnect Budget Results
- Frank R. Libsch
- Hiroyuki Mori
- 2023
- ECTC 2023
Modeling of the Temperature Profile and Residual Stress During Thermal Compression Bonding in 3D Packages
- Prabudhya Roy Chowdhury
- Sathya Raghavan
- et al.
- 2023
- ECTC 2023
Next Generation Infrared (IR) Laser Debonding / Silicon Handle Technology for Precision Chiplet Technology Applications
- Qianwen Chen
- Michael Belyansky
- et al.
- 2023
- ECTC 2023
On the path to AI hardware via chiplet integration enabled by high density organic substrates
- Griselda Bonilla
- Brian Quinlan
- et al.
- 2023
- ECTC 2023
Thermal Characterization of 3-D Stacked Heterogeneous Integration (HI) Package for High-Power Computing Applications
- Aakrati Jain
- Risa Miyazawa
- et al.
- 2023
- ECTC 2023
A Scalable Heterogeneous AiP Module for a 256-Element 5G Phased Array
- Duixian Liu
- Xiaoxiong Gu
- et al.
- 2023
- ECTC 2023
A Methodology to Optimize Laser Dicing Parameters to Maximize Dicing Quality Through Machine Learning
- Sathya Raghavan
- Aakrati Jain
- et al.
- 2023
- ECTC 2023
Volume-controllable Solder Bumping Technology to Package Substrate Using Injection Molded Solder for Fine-pitch Flip Chip
- Toyohiro Aoki
- Katsuyuki Sakuma
- et al.
- 2023
- ECTC 2023
Electrical Characterization and Modeling of 2-µm and 1.5-µm Line-and-Space High-Density Signal Wiring in Organic Interposer
- Atom O. Watanabe
- Xiaoxiong Gu
- et al.
- 2023
- ECTC 2023