Essential edge protection techniques for successful multi-wafer stacking
- Joshua Rubin
- Kevin Winstel
- et al.
- 2015
- S3S 2015
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52 results for Chiplets
Advances in percolated thermal underfill (PTU) simulations for 3D-integration
- Sridhar Kumar
- Uwe Zschenderlein
- et al.
- 2015
- EuroSimE 2015
A 40 GS/s 8b-DAC SST-TX in 7 nm FinFET CMOS for cryogenic quantum applications with 32kB SRAM-based RF-DDS AWG
- 2024
- ESSERC 2024
A Scalable Heterogeneous AiP Module for a 256-Element 5G Phased Array
- Alberto Valdes Garcia
- 2024
- IMS 2024
Evolution of patterning materials towards the Moore's Law 2.0 Era
- Dario L. Goldfarb
- 2022
- Japanese Journal of Applied Physics
Design of synchronous frequency dividers in 5-nm FinFET CMOS technology
- 2023
- Electronics Letters
Innovative Chiplet Integration Technologies for HPC and AI Hardware Systems
- Griselda Bonilla
- 2023
- iTHERM 2023
Interconnects for DNA, Quantum, In-Memory, and Optical Computing: Insights From a Panel Discussion
- Amlan Ganguly
- Sergi Abadal
- et al.
- 2021
- IEEE Micro
Co-package technology platform for low-power and low-cost data centers
- Konstantinos Papatryfonos
- David R. Selviah
- et al.
- 2021
- Applied Sciences
3-D Die Stacking with 55 μm Pitch Interconnections on Advanced Ground-Rule Laminate for Artificial Intelligence System
- Katsuyuki Sakuma
- Mukta Farooq
- et al.
- 2021
- IEEE Transactions on CPMT