A Scalable Heterogeneous AiP Module for a 256-Element 5G Phased Array
- Alberto Valdes Garcia
- 2024
- IMS 2024
Publications
Date
Featured collections
Popular topics
49 results for Chiplets
Evolution of patterning materials towards the Moore's Law 2.0 Era
- Dario L. Goldfarb
- 2022
- Japanese Journal of Applied Physics
Design of synchronous frequency dividers in 5-nm FinFET CMOS technology
- 2023
- Electronics Letters
Innovative Chiplet Integration Technologies for HPC and AI Hardware Systems
- Griselda Bonilla
- 2023
- iTHERM 2023
Interconnects for DNA, Quantum, In-Memory, and Optical Computing: Insights From a Panel Discussion
- Amlan Ganguly
- Sergi Abadal
- et al.
- 2021
- IEEE Micro
Co-package technology platform for low-power and low-cost data centers
- Konstantinos Papatryfonos
- David R. Selviah
- et al.
- 2021
- Applied Sciences
3-D Die Stacking with 55 μm Pitch Interconnections on Advanced Ground-Rule Laminate for Artificial Intelligence System
- Katsuyuki Sakuma
- Mukta Farooq
- et al.
- 2021
- IEEE Transactions on CPMT
Packaging and Antenna Integration for Silicon-Based Millimeter-Wave Phased Arrays: 5G and Beyond
- Xiaoxiong Gu
- Duixian Liu
- et al.
- 2021
- IEEE Journal of Microwaves
Detection of Printable EUV Mask Absorber Defects and Defect Adders by Full Chip Optical Inspection of EUV Patterned Wafers
- Luciana Meli
- Ravi Bonam
- et al.
- 2017
- IEEE Trans Semicond Manuf