Impact of the electrochemical properties of silicon wafer surfaces on copper outplating from HF solutions
- I. Teerlinck
- P.W. Mertens
- et al.
- 1996
- JES
Publications
509 results at JES
Etching of tantalum in fluorine-containing high density plasmas
- R. Hsiao
- D.C. Miller
- 1996
- JES
Electromigration drift velocity in Al-alloy and Cu-alloy lines
- C.-K. Hu
- K.Y. Lee
- et al.
- 1996
- JES
Nonphotosensitive, vertically redundant two-channel a-Si:H thin film transistor
- Yue Kuo
- 1996
- JES
Wettability of polished silicon oxide surfaces
- Richard R. Thomas
- Frank B. Kaufman
- et al.
- 1996
- JES
Alloying of a Less Noble Metal in Electrodeposited Cu Through Underpotential Deposition
- Hariklia Deligianni
- I-Chia Hsu Chang
- et al.
- 1995
- JES
Fabrication of an array of precision nozzles by through-mask electrochemical micromachining
- Madhav Datta
- 1995
- JES
Plasma Etching and Deposition for a-Si: H Thin Film Transistors
- Yue Kuo
- 1995
- JES
PECVD Silicon Nitride as a Gate Dielectric for Amorphous Silicon Thin Film Transistor Process and Device Performance
- Yue Kuo
- 1995
- JES
Corrosion and Protection of a Conductive Silver Paste
- V. Brusic
- G.S. Frankel
- et al.
- 1995
- JES