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Systematic investigation of Sn-Ag and Sn-Cu modified by minor alloying element of titaniumW.M. ChenS.K. Kanget al.2012ECTC 2012
Wafer level underfill for area array Cu pillar flip chip packaging of ultra low-k chips on organic substratesJae-Woong NahMichael Gayneset al.2012ECTC 2012
2.5D and 3D technology challenges and test vehicle demonstrationsJohn KnickerbockerPaul Andryet al.2012ECTC 2012
Micro-interconnection reliability: Thermal, electrical and mechanical stressSteven L. WrightCornelia Tsanget al.2012ECTC 2012
Multiple voltage-supplies in TSV-based three-dimensional (3D) power distribution networksZheng XuXiaoxiong Guet al.2012ECTC 2012