Publications

Morphology of Low-Temperature All-Copper Interconnects Formed by Dip Transfer
- - Luca Del Carro
  - Jonas Zuercher
  - et al.
- 2017
- ECTC 2017
Thermo-Compression Bonding and Mass Reflow Assembly Processes of 3D Logic Die Stacks
- - Pascale Gagnon
  - Christian Bergeron
  - et al.
- 2017
- ECTC 2017
Novel, High-Throughput, Fiber-to-Chip Assembly Employing only Off-the-Shelf Components
- - Nicolas Boyer
  - Alexander Janta-Polczynski
  - et al.
- 2017
- ECTC 2017
Optoelectronic Chip Assembly Process of Optical MCM
- - Masao Tokunari
  - Koji Masuda
  - et al.
- 2017
- ECTC 2017
Creation and interaction with large-scale domain-specific knowledge bases
- - S. Bharadwaj
  - Laura Chiticariu
  - et al.
- 2017
- VLDB 2017
Learning cognitive features from gaze data for sentiment and sarcasm classification using convolutional neural network
- - Abhijit Mishra
  - Kuntal Dey
  - et al.
- 2017
- ACL 2017
Information-Theory interpretation of the skip-Gram negative-Sampling objective function
- - Jacob Goldberger
  - Oren Melamud
- 2017
- ACL 2017
Argumentation quality assessment: Theory vs. Practice
- - Henning Wachsmuth
  - Nona Naderi
  - et al.
- 2017
- ACL 2017
Group sparse CNNs for question classification with answer sets
- - Mingbo Ma
  - Liang Huang
  - et al.
- 2017
- ACL 2017
Neural semantic parsing over multiple knowledge-bases
- - Jonathan Herzig
  - Jonathan Berant
- 2017
- ACL 2017