Publications

This is our catalog of recent publications authored by IBM researchers, in collaboration with the global research community. We’re currently adding our back catalog of more than 110,000 publications. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

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Year

An enhanced thermo-compression bonding process to address warpage in 3D integration of large die on organic substrates
- - Katsuyuki Sakuma
  - Krishna Tunga
  - et al.
- 2015
- ECTC 2015
Influence of UBM metallurgy on Sn textures and em failure
- - Minhua Lu
  - Hongqing Zhang
- 2015
- ECTC 2015
Silicon photonics packaging for highly scalable optical interconnects
- - A. La Porta
  - J. Weiss
  - et al.
- 2015
- ECTC 2015
Through silicon via process for effective multi-wafer integration
- - Akihiro Horibe
  - Kuniaki Sueoka
  - et al.
- 2015
- ECTC 2015
Electromigration and thermal migration in Pb-free interconnects
- - Minhua Lu
  - Thomas Wassick
  - et al.
- 2015
- ECTC 2015
Embedded power insert enabling dual-side cooling of microprocessors
- - Thomas Brunschwiler
  - Dominic Gschwend
  - et al.
- 2015
- ECTC 2015
Semiconductor optical amplifier (SOA) packaging for scalable and gain-integrated silicon photonic switching platforms
- - Russell A. Budd
  - Laurent Schares
  - et al.
- 2015
- ECTC 2015
Defect mitigation of plasma-induced delamination of TiW/Cu from SiN_x layer in thin si interposer processing with glass carriers
- - Vijay Sukumaran
  - Thuy Tran-Quinn
  - et al.
- 2015
- ECTC 2015
Improved connectorization of compliant polymer waveguide ribbon for silicon nanophotonics chip interfacing to optical fibers
- - Yoichi Taira
  - Hidetoshi Numata
  - et al.
- 2015
- ECTC 2015
Dual-side cooling for a three-dimensional (3D) chip stack : Additional cooling from the laminate (substrate) side
- - Keiji Matsumoto
  - Hiroyuki Mori
  - et al.
- 2015
- ECTC 2015