Publications

This is our catalog of recent publications authored by IBM researchers, in collaboration with the global research community. We’re currently adding our back catalog of more than 110,000 publications. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

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Year

Semiconductor optical amplifier (SOA) packaging for scalable and gain-integrated silicon photonic switching platforms
- - Russell A. Budd
  - Laurent Schares
  - et al.
- 2015
- ECTC 2015
Defect mitigation of plasma-induced delamination of TiW/Cu from SiN_x layer in thin si interposer processing with glass carriers
- - Vijay Sukumaran
  - Thuy Tran-Quinn
  - et al.
- 2015
- ECTC 2015
Improved connectorization of compliant polymer waveguide ribbon for silicon nanophotonics chip interfacing to optical fibers
- - Yoichi Taira
  - Hidetoshi Numata
  - et al.
- 2015
- ECTC 2015
Dual-side cooling for a three-dimensional (3D) chip stack : Additional cooling from the laminate (substrate) side
- - Keiji Matsumoto
  - Hiroyuki Mori
  - et al.
- 2015
- ECTC 2015
Novel mass reflow method for organic substrates
- - Vijay D. Khanna
  - Sri M. Sri-Jayantha
- 2015
- ECTC 2015
A multilayer organic package with four integrated 60GHz antennas enabling broadside and end-fire radiation for portable communication devices
- - Xiaoxiong Gu
  - Duixian Liu
  - et al.
- 2015
- ECTC 2015
Simulation of thermal pulse evolution during laser debonding
- - Bucknell Webb
  - Paul Andry
- 2015
- ECTC 2015
Nanoparticle assembly and sintering towards all-copper flip chip interconnects
- - Jonas Zürcher
  - Kerry Yu
  - et al.
- 2015
- ECTC 2015
Automated, self-aligned assembly of 12 fibers per nanophotonic chip with standard microelectronics assembly tooling
- - Tymon Barwicz
  - Nicolas Boyer
  - et al.
- 2015
- ECTC 2015
Flip chip assembly with sub-micron 3D re-alignment via solder surface tension
- - Jae Woong Nah
  - Yves Martin
  - et al.
- 2015
- ECTC 2015