Topological semimetal interface resistivity scaling for vertical interconnect applications
- Nicholas A. Lanzillo
- Utkarsh Bajpai
- et al.
- 2024
- Applied Physics Letters
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New approach of local critical dimension uniformity improvement for via/contact hole etch with direct current superposition
- Emilia W. Hirsch
- Dominik Metzler
- et al.
- 2024
- JVSTB