Publications

247 results for AI Hardware

Heterogeneous Integration on Organic Interposer Substrate with fine-pitch RDL and 40 micron pitch Micro-bumps
- - Katsuyuki Sakuma
  - Griselda Bonilla
  - et al.
- 2023
- ECTC 2023
Development of a Plasma Etching Process of Copper for the Microfabrication of High-Density Interconnects in Advanced Packaging
- - Juliano Borges
  - Maxime Darnon
  - et al.
- 2023
- ECTC 2023
Volume-controllable Solder Bumping Technology to Package Substrate Using Injection Molded Solder for Fine-pitch Flip Chip
- - Toyohiro Aoki
  - Katsuyuki Sakuma
  - et al.
- 2023
- ECTC 2023
HBM3 Modules on Latest High Density Organic Laminate—Signal Integrity Design and Analysis with Interconnect Budget Results
- - Frank R. Libsch
  - Hiroyuki Mori
- 2023
- ECTC 2023
Signal and Power Integrity Design and Analysis for Bunch-of-Wires (BoW) Interface for Chiplet Integration on Advanced Packaging
- - Ram Krishna
  - Atom O. Watanabe
  - et al.
- 2023
- ECTC 2023
CFD Simulation Analysis of Inter/Intra Chip Liquid Cooling for 3D Stacked ICs
- - Risa Miyazawa
  - Hiroyuki Mori
  - et al.
- 2023
- iTHERM 2023
Innovative Chiplet Integration Technologies for HPC and AI Hardware Systems
- - Griselda Bonilla
- 2023
- iTHERM 2023
Acceleration of Decision-Tree Ensemble Models on the IBM Telum Processor
- - Nikolaos Papandreou
  - Jan Van Lunteren
  - et al.
- 2023
- ISCAS 2023
Architectures and Circuits for Analog-memory-based Hardware Accelerators for Deep Neural Networks
- - Sidney Tsai
  - Pritish Narayanan
  - et al.
- 2023
- ISCAS 2023
Physical modeling and design rules of analog Conductive Metal Oxide-HfO2 ReRAM
- - Donato Francesco Falcone
  - Stephan Menzel
  - et al.
- 2023
- IMW 2023