HBM3 Modules on Latest High Density Organic Laminate—Signal Integrity Design and Analysis with Interconnect Budget Results

Abstract

This paper provides the full HBM3 system interconnect signal integrity design, link budget analysis and a positive timing margin closure solution for the latest generation high density organic laminate capable of line widths and spaces of 1.5µ m. Also analyzed is the high density organic packaging scalability that includes inter-layer misregistration and dielectric thickness variations.