Die-to-wafer 3D integration technology for high yield and throughput
- Katsuyuki Sakuma
- Paul S. Andry
- et al.
- 2008
- MRS Fall Meeting 2008
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14288 results for Physical Sciences
Hotspot-optimized interlayer cooling in vertically integrated packages
- 2008
- MRS Fall Meeting 2008
Improving silicon crystallinity by grain reorientation annealing
- K.L. Saenger
- J.P. De Souza
- et al.
- 2009
- MRS Spring Meeting 2009
Crystallization characteristics of Ge-Sb phase change materials
- Simone Raoux
- Cyril Cabrai Jr.
- et al.
- 2009
- MRS Spring Meeting 2009
The influence of nitrogen doping on the chemical and local bonding environment of amorphous and crystalline Ge2Sb2Te 5
- J.S. Washington
- E. Joseph
- et al.
- 2009
- MRS Spring Meeting 2009
Stress gradients observed in Cu thin films induced by capping layers
- Conal E. Murray
- Paul R. Besser
- et al.
- 2009
- MRS Spring Meeting 2009
Dual damascene reactive ion etch polymer characterization through x-ray photoelectron spectroscopy for 65 nm and 45nm technology nodes
- Samuel S. Choi
- Chet Dziobkowski
- et al.
- 2009
- MRS Spring Meeting 2009
Demonstration of highly scaled FinFET SRAM cells with high-Κ/metal gate and investigation of characteristic variability for the 32 nm node and beyond
- H. Kawasaki
- M. Khater
- et al.
- 2008
- IEDM 2008
Gate length scaling and high drive currents enabled for high performance SOI technology using high-κ/metal gate
- K. Henson
- H. Bu
- et al.
- 2008
- IEDM 2008
On the difference of temperature dependence of metal gate and poly gate SOI MOSFET threshold voltages
- Shu-Jen Han
- Xinlin Wang
- et al.
- 2008
- IEDM 2008