Development of a Plasma Etching Process of Copper for the Microfabrication of High-Density Interconnects in Advanced Packaging
- Juliano Borges
- Maxime Darnon
- et al.
- 2023
- ECTC 2023
Publications
1.65 µm L/S high density interconnect on organic substrate by advanced semi-additive process for HPC applications
- Hussein Hamieh
- Juliano Borges
- et al.
- 2023
- ECTC 2023
High Density Photonic Reservoir Computing using Optical Fiber and Polymer Waveguide
- Hidetoshi Numata
- Toshiyuki Yamane
- et al.
- 2023
- ECTC 2023
A Scalable Heterogeneous AiP Module for a 256-Element 5G Phased Array
- Duixian Liu
- Xiaoxiong Gu
- et al.
- 2023
- ECTC 2023
Rethinking Searchable Symmetric Encryption
- Zichen Gui
- Kenneth G. Paterson
- et al.
- 2023
- S&P 2023
Fashion Faux Pas: Implicit Stylistic Fingerprints for Bypassing Browsers' Anti-Fingerprinting Defenses
- Xu Lin
- Frederico Araujo
- et al.
- 2023
- S&P 2023
Federated Learning with Flexible Control
- Shiqiang Wang
- Jake Perazzone
- et al.
- 2023
- INFOCOM 2023
Adhere: Automated Detection and Repair of Intrusive Ads
- Yutian Yan
- Yunhui Zheng
- et al.
- 2023
- ICSE 2023
Decomposing a Recurrent Neural Network into Modules for Enabling Reusability and Replacement
- Sayem Mohammad Imtiaz
- Fraol Batole
- et al.
- 2023
- ICSE 2023
Automated Metamorphic Testing using Transitive Relations for Specializing Stance Detection Models
- Alisa Arno
- Futoshi Iwama
- et al.
- 2023
- ICSE 2023