Surface Energy Characterization for Die-Level Cu Hybrid Bonding
- Katsuyuki Sakuma
- Roy Yu
- et al.
- 2022
- ECTC 2022
Publications
Super Fine Jet Underfill Dispense Technique for Robust Micro Joint in Direct Bonded Heterogeneous Integration (DBHi) Silicon Bridge Packages
- Akihiro Horibe
- Chinami Marushima
- et al.
- 2022
- ECTC 2022
Dimensional Parameters Controlling Capillary Underfill Flow for Void-Free Encapsulation of a Direct Bonded Heterogeneous Integration (DBHi) Si-bridge Package
- Chinami Marushima
- Toyohiro Aoki
- et al.
- 2022
- ECTC 2022
Thermo-mechanical Analysis of Thermal Compression Bonding Chip-Join Process
- Prabudhya Roy Chowdhury
- Katsuyuki Sakuma
- et al.
- 2022
- ECTC 2022
Solder and Organic Adhesive Hybrid Bonding Technology with Non-strip Type Photosensitive Resin and Injection Molded Solder (IMS)
- Keiji Matsumoto
- Takahito Watanabe
- et al.
- 2022
- ECTC 2022
Characterization of Non-Conductive Paste Materials (NCP) for Thermocompression Bonding in a Direct Bonded Heterogeneously Integrated (DBHi) Si- Bridge Package
- Akihiro Horibe
- Takahito Watanabe
- et al.
- 2022
- ECTC 2022
Sine Series Approximation of the Mod Function for Bootstrapping of Approximate HE
- Charanjit Jutla
- Nathan Manohar
- 2022
- Eurocrypt 2022
Practical Non-interactive Publicly Verifiable Secret Sharing with Thousands of Parties
- Craig Gentry
- Shai Halevi
- et al.
- 2022
- Eurocrypt 2022
Constrained Multi-Task Learning for Bridging Resolution
- Hideo Kobayashi
- Yufang Hou
- 2022
- ACL 2022
Fantastic Questions and Where to Find Them: FairytaleQA–An Authentic Dataset for Narrative Comprehension
- Ying Xu
- Dakuo Wang
- et al.
- 2022
- ACL 2022