Electromigration extendibility of Cu(Mn) alloy-seed interconnects, and understanding the fundamentals
- Takeshi Nogami
- C. Penny
- et al.
- 2012
- IEDM 2012
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3 results for Todd E. Ryan
High reliability 32 nm Cu/ULK BEOL based on PVD CuMn seed, and its extendibility
- Takeshi Nogami
- Tibor Bolom
- et al.
- 2010
- IEDM 2010
Progress in the development and understanding of advanced low k and ultralow k dielectrics for very large-scale integrated interconnects - State of the art
- Alfred Grill
- Stephen M. Gates
- et al.
- 2014
- Applied Physics Reviews