Vacuum underfill technology for advanced packaging (IMPACT 2011)
- M. Hoshiyama
- M. Hasegawa
- et al.
- 2011
- IMPACT 2011
Publications
59 results for Katsuyuki Sakuma
Fluxless bonding for fine-pitch and low-volume solder 3-D interconnections
- Katsuyuki Sakuma
- Kazushige Toriyama
- et al.
- 2011
- ECTC 2011
Vacuum underfill technology for advanced packaging
- Akihiro Horibe
- M.-C. Paquet
- et al.
- 2011
- ECTC 2011
Solder/adhesive bonding using simple planarization technique for 3D integration
- Masatsugu Nimura
- Jun Mizuno
- et al.
- 2011
- ECTC 2011
Development trend of three-dimensional (3D) integration technology
- 2011
- IEEJ Transactions on Sensors and Micromachines
Development of vacuum underfill technology for a 3D chip stack
- Katsuyuki Sakuma
- Sayuri Kohara
- et al.
- 2011
- JMM
IMC bonding for 3D interconnection
- Katsuyuki Sakuma
- Kuniaki Sueoka
- et al.
- 2010
- ECTC 2010
Effects of vacuum ultraviolet surface treatment on the bonding interconnections for flip chip and 3-D integration
- Katsuyuki Sakuma
- Jun Mizuno
- et al.
- 2010
- IEEE Transactions on Electronics Packaging Manufacturing
Effects of excimer irradiation treatment on thermocompression Au-Au bonding
- Naoko Unami
- Katsuyuki Sakuma
- et al.
- 2010
- Japanese Journal of Applied Physics
Die-to-wafer 3D integration technology for high yield and throughput
- Katsuyuki Sakuma
- Paul S. Andry
- et al.
- 2008
- MRS Fall Meeting 2008