Chiplet and Heterogeneous integration Technologies for HPC and AI
- 2025
- VLSI Technology and Circuits 2025
Publications
59 results for Katsuyuki Sakuma
Electrical Performance of Hybrid Bonding with Sub-Micron Cu-Cu Bonding Contacts: Effects of Scaling, Microstructure, and Surface Morphology
- Sari Zerey
- Alina Bennett-dubin
- et al.
- 2025
- ECTC 2025
Characterization of Interfacial Fracture Strength in Hybrid Bonded Wafers: A Novel Approach for High-Resolution Spatial Profiling
- Sathya Raghavan
- Ben Yang
- et al.
- 2025
- ECTC 2025
D2W and W2W Hybrid bonding system with below 2.5 micron pitch for 3D chiplet AI applications
- Katsuyuki Sakuma
- Roy Yu
- et al.
- 2024
- IEDM 2024
A Microstructural Investigation of Sub-1 μm Copper Bonding Contact Structures in Die-to-Wafer Hybrid Bonding
- Sari Zerey
- Junghyun Cho
- et al.
- 2024
- ECTC 2024
Role of Interfacial Microstructure on Electromigration Behavior of The Hybrid Bonding in 3D Integration
- Sari Zerey
- Roy Yu
- et al.
- 2024
- MRS Spring Meeting 2024
Healthcare Wearable Sensors Adhesion to Human Fingernails and Toenails
- Katsuyuki Sakuma
- Leanna Pancoast
- et al.
- 2023
- Micromachines
A Methodology to Optimize Laser Dicing Parameters to Maximize Dicing Quality Through Machine Learning
- Sathya Raghavan
- Aakrati Jain
- et al.
- 2023
- ECTC 2023
Thermal Characterization of 3-D Stacked Heterogeneous Integration (HI) Package for High-Power Computing Applications
- Aakrati Jain
- Risa Miyazawa
- et al.
- 2023
- ECTC 2023
Voids-free Die-level Cu/ILD Hybrid bonding
- Katsuyuki Sakuma
- Roy Yu
- et al.
- 2023
- ECTC 2023