Fluxless TCB with Atmospheric Pressure Plasma Surface Treatment Enabling Ultra-Fine Pitch Solder Micro-Bumps for 3D Integration
- Mohammed Alhendi
- Luke Darling
- et al.
- 2026
- ECTC 2026
Short paper
Publications
60 results for Katsuyuki Sakuma
Chiplet and Heterogeneous integration Technologies for HPC and AI
- 2025
- VLSI Technology and Circuits 2025
Workshop paperElectrical Performance of Hybrid Bonding with Sub-Micron Cu-Cu Bonding Contacts: Effects of Scaling, Microstructure, and Surface Morphology
- Sari Al Zerey
- Alina Bennett
- et al.
- 2025
- ECTC 2025
Conference paperCharacterization of Interfacial Fracture Strength in Hybrid Bonded Wafers: A Novel Approach for High-Resolution Spatial Profiling
- Sathya Raghavan
- Ben Yang
- et al.
- 2025
- ECTC 2025
Conference paperD2W and W2W Hybrid bonding system with below 2.5 micron pitch for 3D chiplet AI applications
- Katsuyuki Sakuma
- Roy Yu
- et al.
- 2024
- IEDM 2024
Invited talkA Microstructural Investigation of Sub-1 μm Copper Bonding Contact Structures in Die-to-Wafer Hybrid Bonding
- Sari Zerey
- Junghyun Cho
- et al.
- 2024
- ECTC 2024
Conference paperRole of Interfacial Microstructure on Electromigration Behavior of The Hybrid Bonding in 3D Integration
- Sari Zerey
- Roy Yu
- et al.
- 2024
- MRS Spring Meeting 2024
TalkHealthcare Wearable Sensors Adhesion to Human Fingernails and Toenails
- Katsuyuki Sakuma
- Leanna Pancoast
- et al.
- 2023
- Micromachines
PaperThermal Characterization of 3-D Stacked Heterogeneous Integration (HI) Package for High-Power Computing Applications
- Aakrati Jain
- Risa Miyazawa
- et al.
- 2023
- ECTC 2023
Conference paperNext Generation Infrared (IR) Laser Debonding / Silicon Handle Technology for Precision Chiplet Technology Applications
- Qianwen Chen
- Michael Belyansky
- et al.
- 2023
- ECTC 2023
Conference paper