High-Resolution Nanoscale X-ray Imaging for Non-Destructive Inspection of Copper Grains in Fine-Pitch Pads for Hybrid Bonding
- Nimish Nazirkar
- Nicholas Polomoff
- et al.
- 2026
- ECTC 2026
Conference paper
Publications
64 results for Katsuyuki Sakuma
Exploring Cu-Cu Hybrid Bonding Failure Mechanisms under Current Stress via 3D Focused Ion Beam Tomography
- Sari Zerey
- Junghyun Cho
- et al.
- 2026
- ECTC 2026
Conference paperFluxless TCB with Atmospheric Pressure Plasma Surface Treatment Enabling Ultra-Fine Pitch Solder Micro-Bumps for 3D Integration
- Mohammed Alhendi
- Luke Darling
- et al.
- 2026
- ECTC 2026
Short paperExploring Cu-Cu Hybrid Bonding Failure Mechanisms under Current Stress via 3D Focused Ion Beam Tomography
- Sari Zerey
- Junghyun Cho
- et al.
- 2026
- ECTC 2026
TalkHybrid bonding surface roughness characterization: A RHEED approach with high speed and atomic scale (sub-nm) sensitivity at wafer level
- Weichang Lin
- Nicholas Polomoff
- et al.
- 2026
- ECTC 2026
TalkChiplet and Heterogeneous integration Technologies for HPC and AI
- 2025
- VLSI Technology and Circuits 2025
Workshop paperCharacterization of Interfacial Fracture Strength in Hybrid Bonded Wafers: A Novel Approach for High-Resolution Spatial Profiling
- Sathya Raghavan
- Ben Yang
- et al.
- 2025
- ECTC 2025
Conference paperElectrical Performance of Hybrid Bonding with Sub-Micron Cu-Cu Bonding Contacts: Effects of Scaling, Microstructure, and Surface Morphology
- Sari Al Zerey
- Alina Bennett
- et al.
- 2025
- ECTC 2025
Conference paperD2W and W2W Hybrid bonding system with below 2.5 micron pitch for 3D chiplet AI applications
- Katsuyuki Sakuma
- Roy Yu
- et al.
- 2024
- IEDM 2024
Invited talkA Microstructural Investigation of Sub-1 μm Copper Bonding Contact Structures in Die-to-Wafer Hybrid Bonding
- Sari Zerey
- Junghyun Cho
- et al.
- 2024
- ECTC 2024
Conference paper