Publications

59 results for Katsuyuki Sakuma

Thermal Characterization of 3-D Stacked Heterogeneous Integration (HI) Package for High-Power Computing Applications
- - Aakrati Jain
  - Risa Miyazawa
  - et al.
- 2023
- ECTC 2023
Heterogeneous Integration on Organic Interposer Substrate with fine-pitch RDL and 40 micron pitch Micro-bumps
- - Katsuyuki Sakuma
  - Griselda Bonilla
  - et al.
- 2023
- ECTC 2023
Volume-controllable Solder Bumping Technology to Package Substrate Using Injection Molded Solder for Fine-pitch Flip Chip
- - Toyohiro Aoki
  - Katsuyuki Sakuma
  - et al.
- 2023
- ECTC 2023
Next Generation Infrared (IR) Laser Debonding / Silicon Handle Technology for Precision Chiplet Technology Applications
- - Qianwen Chen
  - Michael Belyansky
  - et al.
- 2023
- ECTC 2023
Artificial Intelligence (AI) based methodology to minimize asymmetric bare substrate warpage
- - Sathya Raghavan
  - Hiroyuki Mori
  - et al.
- 2023
- ECTC 2023
Fabrication and Performance of 300-mm Wafer-Scale Silicon Microchannel Cooler
- - Evan G. Colgan
  - Kai Schleupen
  - et al.
- 2023
- IEEE Transactions on CPMT
Thermo-mechanical Analysis of Thermal Compression Bonding Chip-Join Process
- - Prabudhya Roy Chowdhury
  - Katsuyuki Sakuma
  - et al.
- 2022
- ECTC 2022
Surface Energy Characterization for Die-Level Cu Hybrid Bonding
- - Katsuyuki Sakuma
  - Roy Yu
  - et al.
- 2022
- ECTC 2022
Functional Testing of AI Cores through Thinned 3D I/O Buffer Dies in 3D Die-Stacked Modules
- - Mukta Farooq
  - Arvind Kumar
  - et al.
- 2022
- ECTC 2022
Plasma Activated Low-temperature Die-level Direct Bonding with Advanced Wafer Dicing Technologies for 3D Heterogeneous Integration
- - Katsuyuki Sakuma
  - Dishit Parekh
  - et al.
- 2021
- ECTC 2021