Conference paper
Illumination system for color filterless liquid crystal display
Yoichi Taira, Daiju Nakano, et al.
EURODISPLAY 2002
This article describes the design, fabrication, and thermal performance of 300-mm-diameter wafer-scale Si microchannel coolers that demonstrated a junction temperature rise of less than 18 °C when dissipating about 14 kW of power. A thermal test wafer, which included hot-spot regions to mimic high-power compute cores, was attached to the wafer-scale microchannel cooler with Pb-Sn solder. Glass manifold layers were attached to the microchannel wafer using a frit material. The average apparent heat transfer coefficient, happ, was about 104000 W/(K-m2).
Yoichi Taira, Daiju Nakano, et al.
EURODISPLAY 2002
Manuel Le Gallo
CIMTEC 2024
G. Karunaratne, M. Hersche, et al.
ESSDERC/ESSCIRC 2022
Tobias Webel, Phillip Restle, et al.
ISSCC 2025