G. Karunaratne, M. Hersche, et al.
ESSDERC/ESSCIRC 2022
This article describes the design, fabrication, and thermal performance of 300-mm-diameter wafer-scale Si microchannel coolers that demonstrated a junction temperature rise of less than 18 °C when dissipating about 14 kW of power. A thermal test wafer, which included hot-spot regions to mimic high-power compute cores, was attached to the wafer-scale microchannel cooler with Pb-Sn solder. Glass manifold layers were attached to the microchannel wafer using a frit material. The average apparent heat transfer coefficient, happ, was about 104000 W/(K-m2).
G. Karunaratne, M. Hersche, et al.
ESSDERC/ESSCIRC 2022
Duixian Liu, Xiaoxiong Gu, et al.
AP-S/URSI 2023
Manabu Kodate, Eisuke Kanzaki, et al.
EURODISPLAY 2002
Evan G. Colgan, Phillip Mann, et al.
ITherm 2024