Publications

This is our catalog of recent publications authored by IBM researchers, in collaboration with the global research community. We’re currently adding our back catalog of more than 110,000 publications. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

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17 results for Keiji Matsumoto

Thermal performance evaluation of dual-side cooling for a three-dimensional (3D) chip stack: Additional cooling from the laminate (substrate) side
- - Keiji Matsumoto
  - Hiroyuki Mori
  - et al.
- 2016
- ICEP 2016
Advanced interconnect technologies in the era of cognitive computing
- - Yasumitsu Orii
  - Akihiro Horibe
  - et al.
- 2016
- Pan Pacific 2016
Cooling from the bottom side (laminate (substrate) side) of a three-dimensional (3D) chip stack
- - Keiji Matsumoto
  - Hiroyuki Mori
  - et al.
- 2014
- 3DIC 2014
Pre-applied inter chip fill for 3D-IC joining
- - Yasuhiro Kawase
  - Makoto Ikemoto
  - et al.
- 2014
- IMAPS 2014
High thermal conductivity underfill for the thermal management of three-dimensional (3D) chip stacks
- - Keiji Matsumoto
  - Hiroyuki Mori
  - et al.
- 2014
- SEMI-THERM 2014
Laminate with thermal - Power insert for efficient front-side heat removal and power delivery
- - Dominic Gschwend
  - Timo Tick
  - et al.
- 2014
- CIPS 2014
Full intermetallic joints for chip stacking by using thermal gradient bonding
- - T.L. Yang
  - Toyohiro Aoki
  - et al.
- 2016
- Acta Materialia