Thermal management for high performance integrated circuits with non-uniform chip power considerations

Abstract

Thermal management for non uniform chip power integrated circuits are studied. Circuit chip power analysis was used to generate non uniform chip power and computational fluid dynamics (CFD) techniques is used to calculate the chip temperature. This paper also presents an integrated thermomechanical analysis of a ceramic ball grid array (CBGA) single chip module (SCM) system under chip power loads. A three-dimensional finite element model (FEM) was used for the sequential heat transfer and mechanical analyses to predict the temperature gradients and associated structural response of stress and deformation of SCM. The thermomechanical analysis results are used for examining the integral effect of chip power loading condition, and two design parameters of substrate and cap materials on the structural integrity of the modeled CBGA SCM system.