Conference paperNEW RELIABLE STRUCTURE FOR HIGH TEMPERATURE MEASUREMENT OF SILICON WAFERS USING A SPECIALLY ATTACHED THERMOCOUPLE.S. Cohen, T.O. Sedgwick, et al.MRS Proceedings 1983
PaperLigand-stabilized copper(I) hexafluoroacetylacetonate complexes: NMR spectroscope and the nature of the copper-alkene bondThomas H. Baum, Carl E. Larson, et al.Journal of Organometallic Chemistry
Conference paperGrowth and transport properties of multilayer superconducting films of Nd1.83Ce0.17CuOx / YBa2Cu3O7-δA. Gupta, R. Gross, et al.SPIE Advances in Semiconductors and Superconductors 1990
TalkAssessing wildfires hazards around the electric gridFernando Marianno, Wang Zhou, et al.INFORMS 2021