PaperQuantum properties of surface space-charge layerssFrank StemC R C Critical Reviews in Solid State Sciences
Conference paperCoupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systemsBiancun Xie, Madhavan Swaminathan, et al.EMC 2011
PaperAb initio molecular dynamics simulation of liquids and solutionsMichiel SprikJournal of Physics Condensed Matter
PaperScanning tunneling microscopy and spectroscopy of thin metal films on the GaAs(110) surfaceP. Martensson, R.M. FeenstraJournal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
