Publication
EMC 2011
Conference paper

Coupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systems

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Abstract

This paper investigates the coupling effect between through-silicon vias (TSVs) in large TSV array structures. A coupling analysis method for large TSV arrays is proposed. Using this method the importance of coupling between TSVs for low resistivity silicon substrates is quantified both in the frequency and time domain. This has been compared with high resistivity silicon substrates. The comparison between the two indicates the importance of jitter and voltage analysis in TSV arrays for low resistivity silicon substrates due to enhanced coupling. © 2011 IEEE.

Date

24 Oct 2011

Publication

EMC 2011

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