A Multiscale Workflow for Thermal Analysis of 3DI Chip Stacks
Max Bloomfield, Amogh Wasti, et al.
ITherm 2025
Recent advances in semiconductor and packaging technologies have accelerated the miniaturization of portable sensing devices including visible-domain cameras, IR cameras, and millimeter-wave (mmWave) radars. Simultaneously, image and sensor data processing capabilities based on Systems-on-Chip (SoCs) have evolved as well to the extent toward the goal of implementing learning-based automatic recognition capabilities. This paper discusses the challenges and opportunities associated with the vertical sensors-to-software integration of portable systems capable of performing multi-spectral imaging, where data from different portions of the EM spectrum is captured, processed, and displayed simultaneously. An example hardware implementation, multi-spectral image data, and potential applications are discussed
Max Bloomfield, Amogh Wasti, et al.
ITherm 2025
Oishy Roy, Ching-Tzu Chen, et al.
Spring HMAVS 2025
Kohei Miyaguchi, Masao Joko, et al.
ASMC 2025
Ullrich R. Pfeiffer, Alberto Valdes-Garcia
IEEE T-MTT