R. Schumacher, J.G. Gordon, et al.
Journal of Electroanalytical Chemistry
Kinetic data on electroless copper deposition from a formaldehyde/EDTA solution are analyzed and discussed in terms of a formal kinetic rate law. The derived rate equation shows first-order dependence on the methylene glycol anion and zeroth order on cupric ion. Kinetic preexponential factors evaluated from temperature dependencies of reaction rates indicate that the rate-determining step involves an adsorbed species. A primary kinetic isotope effect kH/kD = 5 upon substitution of deuterium for protium in formaldehyde indicates that cleavage of the carbon-hydrogen bond of the adsorbed methylene glycol anion is rate determining. © 1985 American Chemical Society.
R. Schumacher, J.G. Gordon, et al.
Journal of Electroanalytical Chemistry
J.H. Kaufman, C.K. Baker, et al.
Physical Review Letters
Owen R. Melroy, K.K. Kanazawa, et al.
Langmuir
K.K. Kanazawa, Owen R. Melroy, et al.
ECS Meeting 1983