Impedance design for multi-layered vias

Abstract

This paper presents a methodology based on a semi-analytical scattering model to pre-design the characteristic impedance of multi-layered through hole vias by choosing appropriate via geometrical parameters, dielectric property, and the placement of ground vias. A linear model as a function of design parameters above is further applied to analyze the statistical variation of impedance for different tolerance specification. © 2008 IEEE.