Solder-Reflowable, High-Throughput Fiber Assembly Achieved by Partitioning of Adhesive Functions
- ECTC 2018
This is our catalog of recent publications authored by IBM researchers, in collaboration with the global research community. We’re currently adding our back catalog of more than 110,000 publications. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.