High-throughput photonic packaging
- Tymon Barwicz
- Ted W. Lichoulas
- et al.
- 2017
- OFC 2017
Conference paper
Publications
12 results at OFC 2017
High capacity VCSEL-based links
- Daniel M. Kuchta
- 2017
- OFC 2017
Conference paperHigh-capacity VCSEL based links
- Daniel M. Kuchta
- 2017
- OFC 2017
Conference paperDriver-Integrated 56-Gb/s segmented electrode silicon Mach Zehnder modulator using optical-domain equalization
- Benjamin G. Lee
- Nicolas Dupuis
- et al.
- 2017
- OFC 2017
Conference paperA polymer waveguide material optimized for on-board optical links and Si photonic interfaces
- Shotaro Takenobu
- Kenta Kobayashi
- et al.
- 2017
- OFC 2017
Conference paper4×50Gb/s NRZ shortwave-wavelength division multiplexing VCSEL link over 50m multimode fiber
- T.N. Huynh
- Fuad Doany
- et al.
- 2017
- OFC 2017
Conference paperMicroprocessor chip with photonic I/O
- Chen Sun
- Mark T. Wade
- et al.
- 2017
- OFC 2017
Conference paperMetamaterial waveguides with low distributed backscattering in production O-band Si photonics
- Bo Peng
- Chi Xiong
- et al.
- 2017
- OFC 2017
Conference paperA silicon metamaterial chip-to-chip coupler for photonic flip-chip applications
- Tymon Barwicz
- Swetha Kamlapurkar
- et al.
- 2017
- OFC 2017
Conference paperIntegrated ferroelectric plasmonic optical modulator
- Andreas Messner
- Felix Eltes
- et al.
- 2017
- OFC 2017
Conference paper