Heterogeneous Integration on Organic Interposer Substrate with fine-pitch RDL and 40 micron pitch Micro-bumps
- Katsuyuki Sakuma
- Griselda Bonilla
- et al.
- 2023
- ECTC 2023
Publications
This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.
Date
Featured collections
Popular topics
23 results at ECTC 2023
High Density Photonic Reservoir Computing using Optical Fiber and Polymer Waveguide
- Hidetoshi Numata
- Toshiyuki Yamane
- et al.
- 2023
- ECTC 2023
Solder Joint Reliability of Fully Homogenised SAC-SnBi Low Temperature BGA Interconnections using Solid Liquid Inter-Diffusion (SLID)
- Hafiz Wakas Ali
- David Danovitch
- et al.
- 2023
- ECTC 2023
HBM3 Modules on Latest High Density Organic Laminate—Signal Integrity Design and Analysis with Interconnect Budget Results
- Frank R. Libsch
- Hiroyuki Mori
- 2023
- ECTC 2023
Modeling of the Temperature Profile and Residual Stress During Thermal Compression Bonding in 3D Packages
- Prabudhya Roy Chowdhury
- Sathya Raghavan
- et al.
- 2023
- ECTC 2023
Next Generation Infrared (IR) Laser Debonding / Silicon Handle Technology for Precision Chiplet Technology Applications
- Qianwen Chen
- Michael Belyansky
- et al.
- 2023
- ECTC 2023
On the path to AI hardware via chiplet integration enabled by high density organic substrates
- Griselda Bonilla
- Brian Quinlan
- et al.
- 2023
- ECTC 2023
Thermal Characterization of 3-D Stacked Heterogeneous Integration (HI) Package for High-Power Computing Applications
- Aakrati Jain
- Risa Miyazawa
- et al.
- 2023
- ECTC 2023
A Scalable Heterogeneous AiP Module for a 256-Element 5G Phased Array
- Duixian Liu
- Xiaoxiong Gu
- et al.
- 2023
- ECTC 2023
A Methodology to Optimize Laser Dicing Parameters to Maximize Dicing Quality Through Machine Learning
- Sathya Raghavan
- Aakrati Jain
- et al.
- 2023
- ECTC 2023