Growth kinetics, polymerization and protection of Cu-X-BTA films

Abstract

Corrosion and oxidation of copper films were evaluated with respect to various pretreatments with inhibitor base using electrochemical trials, accelerated corrosion and thermal oxidation tests. Surface characterization required using ellipsometry. Auger spectrometry and mass spectrometry 5CH3BZT, 5Cl-5ZT and 1H-BZγ form, on the copper surface, protective films that may be considered equivalent on the following plans: kinetics of growth, heat stability, polymerization and wettability.