Publication
Thin Solid Films
Paper

Effects of beam, target and substrate potentials in ion beam processing

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Abstract

Ion beam etching and deposition are normally carried out with beam, target and substrate potentials near ground potential. In this paper, the effects of intentional or unintentional changes in these potentials are described. Examples include beam neutralization, a single extraction grid, substrate bias, and target bias. Each example is described in terms of beam plasma parameters. © 1982.

Date

11 Jun 1982

Publication

Thin Solid Films

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