Michael Ray, Yves C. Martin
Proceedings of SPIE - The International Society for Optical Engineering
The roughening behavior of three basic photoresist polymers (aromatic, adamantyl, adamantyl + lactone) was examined for fluorocarbon/argon plasma etch conditions. The roughening rate, defined as surface roughness introduced per depth of material etched, scales linearly with energy density deposited by the ions at the surface during processing, regardless of plasma process details. The Roughening rate after etch is uniquely determined by polymer structure and energy density. Adamantyl groups cause higher roughening rate. Addition of lactone groups increases removal rates, but leaves the roughening rate at a given energy density unaffected. We also show that sidewall roughness of etched nanostructures directly correlates to surface roughening. © 2009 WILEY-VCH Verlag GmbH & Co. KGaA,.
Michael Ray, Yves C. Martin
Proceedings of SPIE - The International Society for Optical Engineering
A. Krol, C.J. Sher, et al.
Surface Science
Elizabeth A. Sholler, Frederick M. Meyer, et al.
SPIE AeroSense 1997
Hiroshi Ito, Reinhold Schwalm
JES