Characterization of electroplated bismuth-tin alloys for electrically conducting materials

Abstract

Electrically conducting adhesive materials are promising alternatives for lead (Pb)-containing solders in microelectronic applications. However, most common silver-filled epoxy materials have various limitations to meet the requirements of the solder joints yet. To overcome these limitations, several new formulations have been developed recently. Among them, a new high conductivity Pb-free, conducting adhesive developed for low temperature applications has been previously reported. This conducting adhesive contains a conducting copper filler powder coated with a low melting point metal or alloy, such as Sn or BiSn alloys. The low melting point layer serves as a joining material among the filler particles as well as to the substrate. In this paper, characterization of electroplated BiSn alloys on a Cu substrate is reported for their microstructure, electrical properties, oxidation behavior, and others. The experimental results have provided a better understanding of the joining mechanism of the newly developed Pb-free conductive adhesive materials.