About cookies on this site Our websites require some cookies to function properly (required). In addition, other cookies may be used with your consent to analyze site usage, improve the user experience and for advertising. For more information, please review your options. By visiting our website, you agree to our processing of information as described in IBM’sprivacy statement. To provide a smooth navigation, your cookie preferences will be shared across the IBM web domains listed here.
Publication
IEEE Transactions on Components and Packaging Technologies
Paper
A practical implementation of silicon microchannel coolers for high power chips
Abstract
This paper describes a practical implementation of a single-phase Si microchannel cooler designed for cooling very high power chips such as microprocessors. Through the use of multiple heat exchanger zones and optimized cooler fin designs, a unit thermal resistance 10.5 C-mm2W from the cooler surface to the inlet water was demonstrated with a fluid pressure drop of <35 kPa. Further, cooling of a thermal test chip with a micro channel cooler bonded to it packaged in a single chip module was also demonstrated for a chip power density greater than 300 W/cm2. Coolers of this design should be able to cool chips with average power densities of 400 W/cm2 or more. © 2007 IEEE.