IEEE Transactions on Components and Packaging Technologies

A practical implementation of silicon microchannel coolers for high power chips

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This paper describes a practical implementation of a single-phase Si microchannel cooler designed for cooling very high power chips such as microprocessors. Through the use of multiple heat exchanger zones and optimized cooler fin designs, a unit thermal resistance 10.5 C-mm2W from the cooler surface to the inlet water was demonstrated with a fluid pressure drop of <35 kPa. Further, cooling of a thermal test chip with a micro channel cooler bonded to it packaged in a single chip module was also demonstrated for a chip power density greater than 300 W/cm2. Coolers of this design should be able to cool chips with average power densities of 400 W/cm2 or more. © 2007 IEEE.