IBM Telum: a 16-Core 5+ GHz DCM
- Ofer Geva
- Chris Berry
- et al.
- 2022
- ISSCC 2022
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7 results for Jeffrey Zitz
4.1 22nm Next-generation IBM System z microprocessor
- J. Warnock
- Brian Curran
- et al.
- 2015
- ISSCC 2015
Bonding technologies for chip level and wafer level 3D integration
- Katsuyuki Sakuma
- Spyridon Skordas
- et al.
- 2014
- ECTC 2014
A practical implementation of silicon microchannel coolers for high power chips
- E.G. Colgan
- B.K. Furman
- et al.
- 2005
- SEMI-THERM 2005
IBM z14: Enabling physical design in 14-nm technology for high-performance, high-reliability microprocessors
- David Wolpert
- E. Behnen
- et al.
- 2018
- IBM J. Res. Dev
Circuit and physical design of the zenterprise™ ec12 microprocessor chips and multi-chip module
- James Warnock
- Yuen Chan
- et al.
- 2014
- IEEE Journal of Solid-State Circuits
A practical implementation of silicon microchannel coolers for high power chips
- Evan G. Colgan
- Bruce Furman
- et al.
- 2007
- IEEE Transactions on Components and Packaging Technologies