The global chip shortage continues to disrupt supply chains and threaten consumers, businesses, and U.S. national security. In August 2022, President Biden signed the transformational CHIPS and Science Act into law—a historic moment for the future of American innovation. The CHIPS and Science Act sets aside $11 billion for the U.S. Department of Commerce to invest in semiconductor research and development. The CHIPS act also established the National Semiconductor Technology Center (NSTC) and National Advanced Packaging Manufacturing Program to drive advancements in chip R&D.
In response to this need to fuel innovation, IBM has helped to bring together the industry’s top companies, universities, and nonprofits to form the American Semiconductor Innovation Coalition (ASIC). ASIC has outlined its vision for an innovation hub of the NSTC to both bolster chip innovation for the future and to re-establish the U.S. as the global leader in semiconductor research, development, and manufacturing. Because ASIC members are well-established drivers of chip innovation, the NSTC innovation hub could be operational in as early as six months – ready to fuel America’s growth and marshal semiconductor expertise to deliver breakthroughs in chip innovation and production.
Of equal importance is developing a diverse, equitable semiconductor workforce to power U.S. innovation and manufacturing centers. ASIC’s diversity of members is uniquely positioned to lead this charge, from democratizing access to semiconductor research resources to strengthening programs that support chips industry careers.