Photonic packaging in high-throughput microelectronic assembly lines for cost-efficiency and scalability
- OFC 2015
Sebastian Engelmann received his Ph.D. in Materials Science at the University of Maryland, College Park in 2008. His main research activities in Prof. Gottlieb Oehrlein's group were improving the fundamental understanding of plasma-polymer interactions with main focus on 193nm PR resist materials interactions.
He then joined the Advanced Plasma Processing group at the IBM T.J. Watson Research Center in Yorktown Heights, N.Y, where he was developing plasma etch processes to support current and future device generations for exploratory CMOS device research and devices beyond the CMOS era. His main research activities are developing plasma processes that enable the integration of Trigate and Nanowire device geometries, novel materials (SiGe, III-V etc) or completely new technology apporaches (Photonics, MRAM, packaging etc.). Since 2015 he was also manager of the plasma processing group, looking at pioneering new uses of plasma etch technology in conventional and novel applications.
He recently joined the IBM Quantum organization to drive hardware component development for current and future quantum computing systems and is leading global efforts on developing supply chain and hardware ecosystems in this space.
Current and Prior Positions
System Components Lead
9/2021 - Present
Drive Quantum Systems Roadmap
Research Staff Member and Manager
10/2015 - 8/2021
Manage the advanced plasma processing group in Yorktown
Research Staff Member
9/2008 - Present
develop disruptive technologies