Keeping hot chips cool
- Ruchir Puri
- Leon Stok
- et al.
- 2005
- DAC 2005
Bio
Dr. Ruchir Puri is the Chief Scientist of IBM Research, an IBM Fellow, and Vice-President of IBM Corporate Technology and Technical Community. He led IBM Watson as its CTO and Chief Architect from 2016-19 and has held various technical, research, and engineering leadership roles across IBM’s AI and Research businesses.
Dr. Puri is a Fellow of the IEEE, and has been an ACM Distinguished Speaker, an IEEE Distinguished Lecturer, and was awarded 2014 Asian American Engineer of the Year. Ruchir is the recipient of the prestigious Distinguished Alumnus Award from Indian Institute of Technology (IIT), Kanpur and has been an adjunct professor at Columbia University, NY, and a visiting scientist at Stanford University, CA. He was honored with John Von-Neumann Chair at Institute of Discrete Mathematics at Bonn University, Germany. He is an inventor of over 70 US patents and has authored over 120 scientific papers.
Publications
Minimizing power under performance constraint
- 2004
- ICICDT 2004
Scaling planar silicon devices
- Ching-Te Chuang
- Kerry Bernstein
- et al.
- 2004
- IEEE Circuits and Devices Magazine
An Integrated Environment for Technology Closure of Deep-Submicron IC Designs
- Louise Trevillyan
- David Kung
- et al.
- 2004
- IEEE Design and Test of Computers
Turning silicon on its edge
- Edward J. Nowak
- Ingo Aller
- et al.
- 2004
- IEEE Circuits and Devices Magazine
Regular logic fabrics for a via patterned gate array (VPGA)
- K.Y. Tong
- V. Kheterpal
- et al.
- 2003
- CICC 2003
Design and CAD Challenges in sub-90nm CMOS Technologies
- Kerry Bernstein
- Ching-Te Chuang
- et al.
- 2003
- ICCAD 2003
Hysteresis effect in floating-body partially depleted SOI CMOS domino circuits
- Ruchir Puri
- Ching-Te Chuang
- 2003
- International Journal of Electronics
Effects of gate-to-body tunneling current on PD/SOI CMOS latches
- C.T. Chuang
- R. Puri
- 2003
- SISPAD 2003
Pushing ASIC performance in a power envelope
- Ruchir Puri
- Leon Stok
- et al.
- 2003
- DAC 2003
Patents
- US
- 8527920
- US
- 8516412
- US
- 8495552
- JP
- 5306122
- US
- 8365114
- CN
- ZL200910175529.6
- US
- 8271920
- US
- 8261226
- SG
- 160271
- US
- 8122400
Blog posts
These new IBM agents will give developers new ways to solve problems — and clear their backlog
NewsMike MurphyLarge language models revolutionized AI. LLM agents are what’s next
ExplainerKim MartineauThe technology behind InstructLab, a low-cost way to customize LLMs
NewsKim MartineauOpen sourcing IBM’s Granite code models
ReleaseMike Murphy- See more blog posts
